Adhesive Film
SM-CS-402
Epoxy Medium-Temperature Curing Cryogenic Structural Adhesive Film
Product Description：
A medium-temperature curing epoxy cryogenic adhesive film optimized for the assembly of heat-sensitive materials, while retaining ultra-strong cryogenic toughness. Not only does it solve the challenges of flowing and low efficiency associated with large-area liquid adhesive application, but it also significantly lowers the required curing temperature to 120℃. Operating flawlessly in extreme deep-freeze environments down to -269℃, it provides industrial-grade structural strength, making it the ideal solution for composite components and other scenarios that cannot withstand high-temperature baking but urgently require uniform, large-area bonding.
Key Features:
Revolutionary Large-Area Application: The pre-formed film design offers ready-to-use application, completely eliminating the risks of liquid sagging and uneven thickness, thereby multiplying assembly efficiency for cryogenic structures where large-area brushing is not feasible.
Gentler 120℃ Curing Profile: Breaking the limitations of traditional films that require high-temperature activation, it fully cures at just 120℃. This greatly broadens the range of applicable substrates, making it highly suitable for the large-area encapsulation of temperature-sensitive specialty materials.
Outstanding Cryogenic Toughness & Strength: Once cured, it boasts a high elongation at break of 130%-180%, while maintaining a shear strength of 20 MPa at an extreme -196℃, perfectly absorbing the destructive stresses caused by the massive thermal expansion and contraction of dissimilar materials.
Typical Properties
| Property | Value |
| Main Resin | Epoxy |
| Cured Appearance | Light greenish yellow |
| Viscosity @ 25°C (mPa·s) | Semi-Solid |
| Curing Time（25°C,h） | / |
| Track-free Time | / |
| Operation Temperature | -196~60℃ |
| Tensile Strenth : 25℃ / -196℃ | 20.0 MPa / 20.0 MPa |
| Hardness | 65 Shore D |