Thermal Conductive Potting
SM-CS-501
Epoxy Thermal Conductive Potting Cryogenic Structural Adhesive
Product Description：
A thermally conductive epoxy potting adhesive specifically engineered for deep-cryogenic conditions (-269℃ to +100℃). Benefiting from an extended pot life of over 4 hours and low mixed viscosity, it effectively controls the exothermic heat of curing during large-volume operations, making it exceptionally well-suited for the deep potting and sealing of large cryogenic vessels and bulky components. Its specialized formulation ensures effective mitigation of material stress during rapid cooling.
Key Features:
Superior Fluidity for Deep Potting: With a mixed viscosity of only 6000 mPa.s, the adhesive exhibits excellent penetration and leveling properties, easily filling micro-gaps in complex electronic components and precision structures for thorough, blind-spot-free encapsulation.
Efficient Thermal Conductivity & Low-Stress Protection: Features a thermal conductivity of 1.3 W/m·K and a low expansion coefficient after curing. This allows for rapid heat dissipation during cooling while absorbing mechanical stress caused by the contraction of dissimilar materials, preventing cracking or physical damage to the encapsulated parts.
Stable Performance Across Ultra-Wide Temperature Range: Operates reliably within an extreme temperature range of -269℃ to +100℃, providing a robust solution for structural bonding, sealing, and protective encapsulation of pipelines, vessels, and precision components in cryogenic environments.
Typical Properties
| Property | Value |
| Main Resin | Epoxy |
| Cured Appearance | Greenish |
| Viscosity @ 25°C (mPa·s) | 6,000 |
| Curing Time（25°C,h） | 4 |
| Track-free Time | 12 |
| Operation Temperature | -269～100℃ |
| Tensile Strenth : 25℃ / -196℃ | 10.0 MPa / 18.0 MPa |
| Hardness | 80 Shore D |