Overview:

In cryogenic potting, the massive difference in the Coefficient of Thermal Expansion (CTE) between the encapsulant and the sensitive electronic components can generate enormous internal stress during cool-down, tearing the module apart. Our Cryogenic Potting series features specifically formulated fillers that drastically lower the CTE and enhance thermal conductivity, ensuring void-free, low-stress protection for oversized components.

Classic Applications:

Deep-freeze potting for cryogenic magnetic levitation motors

Structural encapsulation and thermal management for MRI equipment.

Large-volume, thick-layer deep potting for general cryogenic components.

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