Electronic-grade High purity and low viscosity.
SM-ER-90HD Resin
High purity and low viscosity.
Product Description：
SM-ER-90HD is a high-purity, low-viscosity trifunctional epoxy resin based on para-aminophenol (TGpAP). Engineered for elite performance, it delivers rapid cure kinetics and superior thermal stability.
CAS NO. 5026-74-4
Classic Applications:
High-temperature structural adhesives
Micro-motor potting/encapsulation
Matrix resin for filament winding, pultrusion, and prepreg systems
High-temperature resistant reactive diluent
Low-halogen electronic-grade adhesives, die-attach adhesives, and conductive adhesive matrices.
Primary matrix or modifying resin for chip encapsulation materials.
Typical Properties
| Property | Value |
| Appearance | Clear, yellow liquid |
| Epoxy Value, eq/100g | 1.0 ~ 1.04 |
| Viscosity @ 25±1°C (mPa·s) | 500 – 1,500 |
| Total Chlorine (ppm) | ≤1,200 |
| Inorganic Chlorine (ppm) | ≤5 |
| Non-volatile Matter (%) | ≥ 99.5 |