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Cryopump Activated Carbon Fixing

SM-CS-302

Epoxy Cryopump Activated Carbon Fixing Cryogenic Adhesive

Product Description:


A high-performance “low-outgassing, anti-penetration” cryogenic adhesive specifically engineered for fixing activated carbon in semiconductor cryopump systems. Building upon excellent thermal conductivity and ultra-low expansion characteristics, this product is rheologically and chemically optimized for high-vacuum, deep-cryogenic environments. Operating reliably through extreme thermal cycles from +100℃ to -269℃, it not only minimizes thermodynamic stress but also perfectly protects the microporous structure of activated carbon from adhesive blockage. It is the ideal solution for packaging core adsorption materials in cryopump arrays and high-precision vacuum equipment.

Key Features:


Anti-Penetration Rheological Control: Tailored for the strong adsorption nature of activated carbon, the adhesive features a low-flow thixotropic state before curing. This fundamentally blocks the penetration of the adhesive into the activated carbon micropores, preventing the carbon from absorbing the adhesive and ensuring zero loss of its original vacuum capture performance.

Extreme Low Outgassing for High Vacuum: Designed specifically for semiconductor-grade ultra-high vacuum chambers, the product boasts an extremely low volatility and low outgassing rate. This effectively prevents molecular-level contamination in the cryogenic environment, safeguarding the cryopump’s ultimate vacuum level and long-term operational stability.

Hard yet Tough Thermal Cycling Resistance: The cured adhesive exhibits high hardness (Shore D 95) combined with excellent toughness (hard but not brittle), coupled with an extremely low expansion coefficient below 30×10^-6/℃. It perfectly withstands the interfacial shear stress generated by severe thermal cycling from +100℃ to -269℃, achieving long-term reliable fixation without cracking or debonding during temperature fluctuations.

Typical Properties


PropertyValue
Main ResinEpoxy
Cured AppearanceGreyish yellow
Viscosity @ 25°C (mPa·s)61,700
Curing Time(25°C,h)6
Track-free Time12
Operation Temperature-269~100℃
Tensile Strenth : 25℃ / -196℃20.0 MPa / 17.0 MPa
Hardness95 Shore D

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