0 Comments

Thermally Conductive Low-Expansion

SM-CS-301

Epoxy Thermally Conductive Low-Expansion Cryogenic Adhesive

Product Description:


A high-performance cryogenic structural adhesive specifically developed for deep-cryogenic scenarios requiring “thermal conductivity, low expansion, and low-stress bonding and encapsulation.” Featuring an excellent thermal conductivity of up to 2.0 W/m·K and an extremely low coefficient of linear expansion below 30×10^-6/K, along with good fluidity, it is highly suitable for potting precision components. It significantly reduces the thermodynamic stress generated between dissimilar materials during extreme cooling processes, fundamentally preventing structural cracking and material damage in cryogenic environments.

Key Features:


Highly Efficient Thermal Conductivity & Ultra-Low Expansion: Delivers exceptional heat dissipation capabilities with a thermal conductivity reaching up to 2.0 W/m·K, while strictly maintaining a coefficient of linear expansion below 30×10^-6/K, ensuring ultimate dimensional stability under severe temperature drops.

Ultimate Low-Stress Anti-Cracking Protection: Relying on its minimal shrinkage and thermal expansion deformation, it significantly minimizes the mechanical stress generated between materials with different expansion coefficients during the cooling process, effectively preventing bondline cracking and physical destruction of the bonded substrates.

Excellent Fluidity & Convenient Potting: Overcoming the high-viscosity limitations of traditional thermally conductive adhesives, the product exhibits good flowability. It easily penetrates and fills the gaps of complex structures, making it extremely convenient for the deep potting and sealing encapsulation of precision cryogenic components.

Typical Properties


PropertyValue
Main ResinEpoxy
Cured AppearanceGreyish yellow
Viscosity @ 25°C (mPa·s)25,000
Curing Time(25°C,h)6
Track-free Time12
Operation Temperature-269~100℃
Tensile Strenth : 25℃ / -196℃20.0 MPa / 18.0 MPa
Hardness65 Shore D

Categories:

发表评论

了解 SophonMatrix 的更多信息

立即订阅以继续阅读并访问完整档案。

继续阅读