High-purity bisphenol-A epoxy.
SM-ER-370 Resin
High-purity bisphenol-A epoxy.
Product Description：
SM-ER-370 is a high-purity, unmodified liquid epoxy resin based on Bisphenol-F. Compared to standard BPA resins, 370 boasts a significantly lower ambient viscosity while delivering a higher crosslink density upon curing. This makes it the ideal choice for high-end applications demanding excellent flowability without sacrificing thermal or chemical resistance.
CAS NO. 2095-03-6
Classic Applications:
Aerospace composite low-viscosity resin.
Electronic grade adhesives.
Conductive adhesive matrix resin.
Semiconductor encapsulation matrix or modifier.
Typical Properties
| Property | Value |
| Appearance | Clear, colorless to pale yellow liquid |
| Epoxy Value, eq/100g | 0.58-0.61 |
| Viscosity @ 25±1°C (mPa·s) | 900 – 1,500 |
| Hydrolyzable Chlorine Content (ppm) | ≤700 |
| Non-volatile Matter (%) | ≥99% |