Epoxy Low-sag
SM-CS-205
Epoxy High-Toughness Cryogenic Adhesive
Product Description：
A high-performance epoxy cryogenic structural adhesive specifically developed for the “precision assembly and low-stress bonding of heterogeneous materials” in deep-cryogenic environments. With its high structural strength (≥20 MPa) and a unique low-shrinkage formulation, it effectively controls interfacial shrinkage stress under extreme conditions ranging from -269℃ to +60℃, making it an ideal solution for the highly reliable structural bonding of precision cryogenic vessels, pipelines, and components made of dissimilar materials.
Key Features:
Low-Shrinkage and Internal Stress Release System: Engineered with a specialized low-shrinkage formulation, it exhibits lower curing shrinkage and reduced internal stress in cryogenic environments compared to standard adhesives, significantly mitigating the risk of interfacial delamination for dissimilar materials during extreme temperature transitions.
Robust Dual-Temperature Structural Integrity: Maintains a stable tensile shear strength exceeding 20 MPa under both room temperature and extreme cryogenic conditions of -196℃.
Superior Operational Processability: Features a high mixed viscosity of 20,000 mPa·s to effectively inhibit sagging, combined with an exceptionally long pot life of over 6 hours.
Typical Properties
| Property | Value |
| Main Resin | Epoxy |
| Cured Appearance | White Yellow |
| Viscosity @ 25°C (mPa·s) | 20,000 |
| Curing Time（25°C,h） | 6 |
| Track-free Time | 12 |
| Operation Temperature | -269～60℃ |
| Tensile Strenth : 25℃ / -196℃ | 20.0 MPa / 20.0 MPa |
| Hardness | 75 Shore D |