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25°C Cured Hight-Temp Resist

SM-AA-101

Room-temp self-curing high-temp composite structural adhesive

Product Description:


Designed specifically for large-scale industrial construction and complex repair operations where heat-curing is impossible due to equipment size or site constraints, yet long-term durability at extreme temperatures is mandatory. As a high-performance heat-resistant modified epoxy adhesive, it overcomes the industry bottleneck of balancing room-temperature curing with high-temperature performance. It achieves efficient crosslinking at room temperature while maintaining robust structural integrity at 200℃, providing reliable support for large-scale electromechanical equipment operating in extreme environments.

Key Features:


Extreme Long-term High-Temperature Strength: Breaking the thermal limitations of conventional room-temperature adhesives, it is engineered for extreme heat. It maintains a tensile shear strength of approximately 10 MPa even during long-term operation at 200℃, ensuring structural reliability under high-thermal stress.

Efficient On-site Curing for Large-scale Projects: Addressing the difficulty of heat-treating large components, the advanced curing system requires only 3 days at 25℃ to reach optimal strength.

Superior Shock Resistance and Structural Toughness: Leveraging an optimal balance of flexibility and modulus, the adhesive provides an impact strength of 12-15 kJ/m². This effectively absorbs dynamic stresses from mechanical vibration and thermal expansion, preventing delamination or brittle failure at large-scale bonded interfaces in high-temperature, vibrating conditions.

Typical Properties


PropertyValue
Main ResinModified Epoxy Resin
Cured AppearanceLight Yellow
Viscosity @ 25°C (mPa·s)10,000~15,000
Curing Time(25°C,h)72
Operation Temperature-40~200℃
Tensile Strenth : 25℃ / 200℃20.0 MPa / 8.0 MPa
T-Peel Strength(23°C,N/mm)1.5
Hardness80 Shore D

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