Room-Temp Fast Curing
SM-AA-301
Room-temp rapid self-curing modified epoxy adhesive
Product Description：
Designed for high-tempo industrial manufacturing and complex heterogeneous bonding. As a high-reactivity modified epoxy adhesive, it provides exceptional structural strength and advanced rapid-curing kinetics, making it an ideal choice for balancing production efficiency with structural reliability.
Key Features:
Industrial-Grade Rapid Curing Efficiency: Achieves a tensile shear strength of over 10 MPa after just 4 hours of curing at room temperature (25℃), significantly reducing process cycle times.
Superior Interfacial Bonding and Peel Strength: Formulated for high-strength structural connections, it effectively overcomes bonding barriers for challenging substrates such as NBR and EPDM rubber (when used with appropriate surface treatments). It delivers outstanding interface integrity across diverse materials, including metals, carbon fiber, and ceramics, making it especially suitable for components subject to high peel stress
Optimized Balance of Efficiency and Structural Toughness: The adhesive offers excellent physical performance (Shore D hardness of 80) and reaches near-maximum structural strength within 24 hours, ensuring long-term structural integrity and fatigue resistance for bonded components.
Typical Properties
| Property | Value |
| Main Resin | Modified Epoxy Resin |
| Cured Appearance | Light Yellow |
| Viscosity @ 25°C (mPa·s) | 10,000-20,000 |
| Curing Time（25°C,h） | 1~2 |
| Operation Temperature | -80~150℃ |
| Tensile Strenth : 25℃ / 200℃ | 20.0 MPa / 2.0 MPa |
| T-Peel Strength（23°C，N/mm） | 4 |
| Hardness | 80 Shore D |