High-Temp resistance, low melt viscosity
SM-ER-50 Resin
High-temperature resistant, low melt viscosity, good mechanical.
Product Description：
SM-ER-50 is a tetramethyl biphenyl (TMBP) crystalline solid epoxy resin. The rigid biphenyl backbone provides remarkably low melt viscosity during processing, while delivering high Tg, outstanding adhesion, and superior moisture/weather resistance post-cure.
CAS NO. 85954-11-6
Classic Applications:
Epoxy Molding Compounds (EMC) for semiconductors.
High-end powder coatings (mirror finish, appliance coatings).
Electronic inks.
High wear and corrosion resistance.
Typical Properties
| Property | Value |
| Appearance | White powder |
| Epoxy Value, eq/100g | ≥0.52 |
| Density@ 25°C, g/mL | 1.149 |
| Melting Point (°C) | 104.0-110.0 |
| Non-volatile Matter (%) | ≤1.5% |
| Flash point, closed cup, °C | 132 |
| Free Chlorine, ppm | ≤100 |