yes
High transparency, yellowing resistance.
High transparency, yellowing resistance.
SM-ER-51 is a tetrafunctional silicone-modified alicyclic epoxy resin. It offers high transparency, excellent yellowing resistance, and high reactivity for cationic and anhydride curing systems, making it ideal for advanced optical and encapsulation applications.
LED encapsulation and optical clear coatings.
UV-curable systems
3D printing resins.
Modifier for standard epoxies to improve weatherability.
| Property | Value |
| Appearance | Clear, colorless to pale yellow liquid |
| Epoxy Value, eq/100g | 0.46~0.54 |
| Viscosity @ 25±1°C (mPa·s) | 2,000 – 4,500 |
| Refractive Index (nD20) | 1.475~1.495 |
| Non-volatile Matter (%) | ≥98% |
High-purity bisphenol-F epoxy.
High-purity bisphenol-F epoxy.
SM-ER-370 is a high-purity, unmodified liquid epoxy resin based on Bisphenol-F. Compared to standard BPA resins, 370 boasts a significantly lower ambient viscosity while delivering a higher crosslink density upon curing. This makes it the ideal choice for high-end applications demanding excellent flowability without sacrificing thermal or chemical resistance.
CAS NO. 2095-03-6
Aerospace composite low-viscosity resin.
Electronic grade adhesives.
Conductive adhesive matrix resin.
Semiconductor encapsulation matrix or modifier.
| Property | Value |
| Appearance | Clear, colorless to pale yellow liquid |
| Epoxy Value, eq/100g | 0.58-0.61 |
| Viscosity @ 25±1°C (mPa·s) | 900 – 1,500 |
| Hydrolyzable Chlorine Content (ppm) | ≤700 |
| Non-volatile Matter (%) | ≥99% |
High-purity bisphenol-A epoxy.
High-purity bisphenol-A epoxy.
SM-ER-328 is a premium, high-purity unmodified liquid epoxy resin based on Bisphenol-A and epichlorohydrin. Manufactured under strict quality control to minimize ionic impurities (e.g., hydrolyzable chlorine) and by-products, it serves as the foundational high-performance matrix for advanced electronic and aerospace formulations.
CAS NO. 1675-54-3
High-purity epoxy VPI (Vacuum Pressure Impregnation) varnishes for motor insulation.
Low-halogen, electronic-grade adhesives requiring strict ionic purity.
Primary matrix or performance modifier for high-end semiconductor encapsulation compounds.
High-strength matrix resin for aerospace composite manufacturing.
| Property | Value |
| Appearance | Clear, colorless to pale yellow liquid |
| Epoxy Value, eq/100g | 0.58-0.60 |
| Viscosity @ 25±1°C (mPa·s) | 3,000 – 5,000 |
| Hydrolyzable Chlorine Content (ppm) | ≤100 |
| Non-volatile Matter (%) | ≥99% |
Tg up to 320°C
Tg up to 320°C, non-crystallizing, easy to use.
SM-ER-9000 is a phenyl trifunctional glycidyl ether epoxy resin featuring very low melt viscosity. Its high functionality and highly aromatic structure yield exceptionally rigid, high-heat, and chemical-resistant cured networks capable of performing in extreme 250–350°C environments.
Copper Clad Laminates (CCL) and high-temp electronic encapsulation.
Aerospace composite prepregs and structural adhesives.
Interior pipe coatings for severe chemical processing.
Semiconductor packaging and IC encapsulation.
| Property | Value |
| Appearance | Pale yellow semi-solid (at 25°C) |
| Epoxy Value, eq/100g | 0.55-0.63 |
| Viscosity @ 72±1°C (mPa·s) | 4,000-8,000 |
| Non-volatile Matter (%) | ≥98.5% |
hot/wet resistance, low coefficient of thermal expansion
Good mechanical properties, good hot/wet resistance, low coefficient of thermal expansion.
SM-ER-65 is a high-purity, low-viscosity liquid naphthalene-based epoxy resin. The rigid naphthalene ring delivers a superior combination of high glass transition temperature (Tg), extremely low moisture absorption, and a low coefficient of thermal expansion (CTE).
CAS NO. 27610-48-6
Hot/wet resistant aerospace composite prepregs.
High-performance Copper Clad Laminate (CCL) matrix or modifier.
| Property | Value |
| Appearance | Red-brown viscous liquid |
| Density@ 25°C, g/mL | 1.22 |
| Epoxy Value, eq/100g | 0.65-0.73 |
| Viscosity @ 50±1°C (mPa·s) | ≤2,000 |
| Non-volatile Matter (%) | ≥98.5% |
High-temperature resistant reactive diluent
High-temperature resistant reactive diluent, minimal loss of thermal resistance compared to aliphatic diluents.
SM-ER-75 is a highly reactive, extremely low-viscosity bifunctional epoxy resin. It serves as a premium reactive diluent, significantly reducing system viscosity while accelerating cure speed and maintaining high crosslink density and thermal resistance.
CAS NO. 101-90-6
Reactive diluent for BPA systems and high-viscosity composites.
Semiconductor packaging and IC encapsulation.
High-performance laminates and structural adhesives.
| Property | Value |
| Appearance | Pale yellow transparent liquid (prone to crystallization) |
| Epoxy Value, eq/100g | 0.75-0.85 |
| Viscosity @ 25±1°C (mPa·s) | 300~500 |
| Non-volatile Matter (%) | ≥98.5% |