In LNG liquefaction, storage, transportation, and regasification engineering, adhesives are primarily used for the interfacial bonding between cold insulation materials (such as polyurethane cryogenic insulation blocks and reinforced fiber insulation panels) in cryogenic containment systems and the inner or outer metal shells of ship bulkheads and high-pressure storage tanks, as well as for the heavy-duty rigid structural bonding and sealing of cryogenic pipeline supports.
This industry imposes extremely stringent requirements on the physical stress redundancy and temperature differential adaptability of products. Under extreme cryogenic conditions ranging from -162°C to -196°C, due to the massive difference in the coefficient of thermal expansion (CTE) between the metal skeleton and soft insulation materials, the adhesive must possess exceptional displacement compensation capabilities to withstand the alternating stresses caused by high-frequency liquid cargo sloshing. Concurrently, it must maintain zero-leakage, tear-resistant physical stability during temperature cycles alternating between room temperature and extreme cold.
Our Solutions
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SM-IC and SM-CS series products feature unique cryogenic cold-work hardening characteristics
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shear and peel resistance inversely surge to over 20 MPa under extreme cold at -196°C
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high thixotropic viscosity, high-damping physical energy-absorbing base, and low shrinkage design perfectly
In aerospace skin assembly, large-area composite laminate splicing of airframes, and precision semiconductor vacuum manufacturing equipment, adhesives are widely applied in the heterogeneous rigid bonding of carbon fiber structural components, the vacuum mechanical sealing of microscopic gaps, and the anti-capillary, high-precision fixation of activated carbon cores in cryopumps.
This field requires materials to possess ultimate dimensional stability and ultra-high vacuum compliance across an extremely wide temperature range. Products must pass rigorous aerospace- and semiconductor-grade Low Outgassing tests to prevent volatile microscopic contamination of chambers and semiconductor wafers. Meanwhile, the material must demonstrate precise physical rheological interception capabilities before curing to prevent macroscopic flow from submerging delicate micro-pores or capillary structures, while also reducing reliance on costly cross-border cold chain logistics.
Our Solutions
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room-temperature stable cryogenic solid film adhesives and special high-vacuum thixotropic adhesives
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forcibly achieving a broad thermodynamic resistance across the main chain of the monomer polymer
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spanning from liquid helium levels (-269°C) to high temperatures of +150°C.
In the precision encapsulation of high-power superconducting generators, high-field superconducting magnet coils (such as MRI medical equipment cores), and high-density electronic components, adhesives act as interlayer insulation impregnation resins, electrical insulating potting bases for partial discharge sites, and physical carriers for rapid heat dissipation channels under extreme conditions.
The core technical pain points in this industry lie in insulation breakdown and microscopic stress accumulation under high charge densities. During drastic and frequent transitions from liquid helium (-269°C) to room temperature, the potting system must possess an extremely high thermal conductivity to instantaneously dissipate localized micro-heat, preventing the thermal runaway of superconducting coils that triggers "quench" burnout. Simultaneously, the coefficient of thermal expansion (CTE) of the resin must be forcibly lowered to synchronize with the metal, and the mixed viscosity must be exceptionally low to completely eliminate any micro-bubbles.
Our Solutions
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large-volume self-leveling thermal potting system and extreme thermal conductive insulating base
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establish a rapid thermal channel of 1.5 W/m·K and violently compress the mixed viscosity down to 6,000 mPa·s.
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completely eliminating insulation dead zones in electrical mechanical assemblies
In the high-throughput, fully automated assembly of modern industrial robot joints, servo motor stators, permanent magnet steels, and carbon-fiber lightweight robotic arms, adhesives are primarily utilized for the heavy-duty rigid structural interlocking between heterogeneous interfaces of metals, non-polar rubbers, and composite materials, as well as the dynamic impact-resistant bonding at sites subjected to high-speed start-stop centrifugal forces.
Automated production lines impose exceedingly high demands on the cross-linking rhythm and dynamic fatigue resistance of materials. The adhesive must be compatible with the fully automated agile coating of microcomputer dispensers on the assembly line, rapidly establishing handling strength at room or medium-low temperatures to compress fixture turnover times. Concurrently, the material must possess extremely high bulk impact strength and shear strength to combat the risks of brittle fracture and delamination in electromechanical equipment under dynamic tremors from high-speed start-stops and frequent forward or reverse rotations.
Our Solutions
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rapid cross-linking modified epoxies and one-component (1K) high-temperature dispensing structural adhesives rapidly establish a 10 MPa physical handling strength just 4 hours after room-temperature application
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By introducing highly efficient shock-absorbing block polymers into the epoxy main chain, the bulk impact strength reaches 29 kJ/m².
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under long-term thermal aging conditions of +150°C to +200°C, physical strength degradation is strictly zero
